HeyJaredSemiWiki
SemiWiki is a specialized technology news and analysis outlet focused on the global semiconductor industry and its surrounding ecosystem.
- Indexed articles, last 90 days
- 58
- Latest publication
- Sep 29, 2026
- Audience
- Top 1M sites
- Earliest in this view
- Jul 5, 2026
Latest articles
Why Advanced Chip Packaging Is Becoming a Design Problem (opens the original)
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As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More The post <a href="https://semiwiki.com/semiconductor-manufact
Pollen Metrology: From a Decade-Long Bet to a Proven AI Platform for Semiconductor Manufacturing (opens the original)
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Recently, I had the opportunity to speak with Johann Foucher, founder and CEO of Pollen Metrology, a French company whose journey offers a rare vantage point on how artificial intelligence is reshaping semiconductor manufacturing from the inside out. What makes Pollen Metrology’s story compelling isn’t just … Read More The post <a href="https://semiwiki.com/lithography/373841-pollen-metrology-from-a-decade-long-bet-to-a-proven-ai-platform-for-semic
Managing Power, Performance and Reliability in the Chiplet Era (opens the original)
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Next-gen AI accelerators, high-performance processors, and complex computing architectures depend heavily on advanced packaging. Bringing multiple dies, chiplets, high-bandwidth memory, and advanced interconnects together into a single 2.5D or 3D package yields massive performance gains. However, this design evolution… Read More The post Managing Power, Performance and Reliability in the Chiplet
Siemens and TSMC push AI deeper into chip design (opens the original)
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Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More The post Siemens and TSMC push AI deeper into chip design appe
Agentic AI Can Reach GDS. What Must It Prove Before Engineers Trust It for Tapeout? (opens the original)
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Agentic AI is beginning to move semiconductor engineering beyond copilots and isolated task automation. From Agentrys’ public material and recent discussion, its architecture points toward a broader engineering flow: Specification → RTL → verification → synthesis / physical design → PPA optimization → physical verification… Read More The post <a href="https://semiwiki.com/eda/agentrys/373853-agentic-ai-can-reach-gds-what-must-it-prove-b
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Top 1M sites
Measured Aug 1, 2026
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