HeyJaredSemiconductor Digest
Semiconductor Digest is a specialized trade and news outlet focused on the global semiconductor ecosystem, with an emphasis on manufacturing, process technology, equipment, and materials.
- Indexed articles, last 90 days
- 202
- Latest publication
- Sep 29, 2026
- Audience
- Top 5M sites
- Earliest in this view
- Jul 6, 2026
Latest articles
Lam’s New Logistics Hub Built for Velocity, Resilience, and AI-Era Growth (opens the original)
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Lam Research has opened its largest U.S. warehouse, a 470,000-square-foot logistics hub designed to strengthen the semiconductor supply chain and support demand for AI-enabled technologies. Located in Livermore, California, the facility helps to improve Lam’s ability to move critical parts, absorb shifts in demand, and support customers with greater speed and predictability. The facility is more than 10 acres (4.4 hectares) under one roof, roughly the size of eight football fields—enough room to
Omdia: IFP/Touch Displays Lead Growth as Global Public Display Market Surpasses $1.73M in 2Q26 (opens the original)
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New research from Omdia’s latest Public Displays Market Tracker reveals that global public display and signage
Gigaphoton Begins Evaluation of L300KZ Excimer Laser for Pulsed Laser Deposition for Advanced Materials Applications (opens the original)
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Gigaphoton Inc., a manufacturer of lightsources for leading-edge semiconductor fabrication processes, today announced that it has installed its L300KZ KrF excimer laser for pulsed laser deposition (PLD) at a domestic manufacturer of high-temperature superconducting wire on September 25, 2026. Developed under Goal 10 of Japan’s Moonshot Research and Development Program, which is administered by the Cabinet Office, the laser evaluation has begun for volume manufacturing of high-temperature superco
Research Institute to Drive Semiconductor Innovation (opens the original)
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The Arkansas Research Institute for Electronics Systems (ARIES) launched today with the aim to develop, produce and deploy next-generation power electronics, microelectronics and semiconductors that thrive in the most challenging environments. Bringing together world-class U of A researchers with track records of success in federal and industry collaboration, ARIES will advance research, innovation, workforce development and technology transition across critical electronics technologies. “ARIES
Global Electronics Association and Fraunhofer Group for Microelectronics Sign MoU to Support Advanced Packaging Industrial Adoption (opens the original)
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The Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing. The collaboration focuses on the APECS pilot line, the European pilot line for advanced packaging and heterogeneous integration for electronics components and systems under the EU Chips Act. APECS is coordinated by the Fraunhofer-Gesellschaft and implemented by Research Fab
Publishing over time
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Audience
Top 5M sites
Measured Aug 1, 2026
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