James Morra
- Indexed articles, last 90 days
- 11
- Latest publication
- Sep 25, 2026
- Outlet visibility, for Electronic Design
- Top 1M sites
- Earliest in this view
- Jul 7, 2026
Latest articles
Capacitors Snap into AI Server Power Supplies (opens the original)
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TDK expanded its series of compact snap-in aluminum electrolytic capacitors, targeting AI server power supply units (PSUs) and other high-performance switch-mode power supplies (SMPS). The capacitors, including the B43645, B43657, B43658, B43659, B43660, and B4366, combine high voltage and capacitance in a space-saving form factor. Featuring diameters from 22 to 35 mm and lengths from 25 to 100 mm, the passives provide a high capacitance-to-volume ratio, which translates to higher power density
Validate AI Data Center Power Supplies via Electronic-Load Emulation (opens the original)
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Data centers face a dual power challenge: Delivering enough power to increasingly dense compute racks and responding fast enough to the rapid load transients created by GPUs and other AI accelerators. "You can think of a GPU as several high-performance computing channels all working in parallel," said James Hitchcock, vice president, general manager, and managing director of Tektronix's EA Elektro-Automatik division. "When a compute rack is prompted, it can draw extremely high currents in very s
Can Embedded Passives Fix AI's Power Delivery Problem? (opens the original)
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Most of the big names in power electronics are chasing the same challenge: Developing voltage regulators that can handle the huge currents required by GPUs and other kilowatt-class AI chips. But with lots of power comes lots of passive components. These DC-DC converters depend on increasingly large clusters of inductors and capacitors that convert, filter, and decouple the power delivered to the processor, helping maintain stable voltage and keeping current within the processor’s ripple envelope
Sensor Bridge Runs It All Through High-Bandwidth Ethernet (opens the original)
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Today, robots rely on a wide range of sensors, including cameras, radar, and LiDAR, to maintain balance, manipulate objects, and move around obstacles. But giving them more ways to sense their surroundings also creates a connectivity problem. Each sensor tends to use a different protocol or proprietary interface, such as MIPI CSI-2 and I2C, requiring increasingly complex point-to-point connections. As more sensors are embedded in robots as well as industrial, military, and medical systems, syste
TI Will Supply U.S.-Made Semiconductors to GE Appliances (opens the original)
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GE Appliances announced it will use U.S.-made chips from Texas Instruments in new laundry machines made at its Louisville, Kentucky headquarters. The appliance manufacturer said TI will supply one-third of the chips for products made at the new laundry plant, with production expected to begin in 2027. According to the companies, the chips will be used for embedded processing, wireless connectivity, motor control, and power management. The partnership is part of GE Appliances’ broader commitment
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