HeyJaredEUV The Focal Point
EUV The Focal Point is your Extreme Ultraviolet (EUV) lithography podcast. Industry Briefings: Cover leading-edge nodes, DRAM, HBM and strategy moves from ASML & co. and from the end customers Apple & co.
- Indexed episodes, last 90 days
- 14
- Latest publication
- Sep 7, 2026
- Audience
- Checking…
- Earliest in this view
- Jul 6, 2026
Latest episodes
[062] Industry briefing - EUV The Focal Point (opens the original)
Read excerpt
This post was created using AI. Please check the information if you want to use it as a basis for decision-making. TSMC says its estimated equipment requirement for 2026 has risen to about 1.9 times the level projected at the end of 2025, showing how quickly AI demand is propagating into fab investment. This week also brings fresh signals from ASML’s Japan support expansion, semiconductor-material capacity in Taiwan, Micron labor risk, and the continuing gap between China’s DUV and EUV capabilit
[061] Deep Dive Topic - Beyond Watts: What Really Determines Productive EUV Output (opens the original)
Read excerpt
This post was created using AI. Please check the information if you want to use it as a basis for decision-making. Beyond Watts: What Really Determines Productive EUV Output EPISODE TEASER EUV lithography used to be dominated by one question: can the source generate enough 13.5-nanometer light for economical wafer throughput? In 2026, that is no longer the whole optimization problem. This episode explains why real fab value increasingly depends on productive output: throughput combined with avai
[060] Industry briefing - EUV The Focal Point (opens the original)
Read excerpt
This post was created using AI. Please check the information if you want to use it as a basis for decision-making. This week is light on new EUV scanner announcements but rich in semiconductor economics. NVIDIA’s demand, SK hynix’s U.S. HBM investment, Hot Chips memory disclosures, and Intel’s 18A-P versus possible TSMC sourcing choices show how utilization, wafer intensity, packaging, and capital allocation are becoming the decisive variables around advanced lithography. Key takeaways - NVIDIA
[059] Industry briefing - EUV The Focal Point (opens the original)
Read excerpt
This post was created using AI. Please check the information if you want to use it as a basis for decision-making. This week is less about a new EUV scanner milestone and more about the economics that determine when lithography capacity becomes valuable. Intel connects 18A-P to Diamond Rapids, Samsung and SMIC show renewed foundry pricing power, and Chinese memory investment continues to scale. Key takeaways: - Intel presented Diamond Rapids at Hot Chips 2026 and tied the product to Intel 18A-P
[058] Industry briefing - EUV The Focal Point (opens the original)
Read excerpt
This post was created using AI. Please check the information if you want to use it as a basis for decision-making. Samsung’s revised foundry roadmap puts High-NA EUV around the 1-nanometer-class generation in 2030 while extending the life of its Low-NA EUV platform. At the same time, record equipment spending, new equity financing, and packaging investments show that the economic race is increasingly about sequencing capital across the whole manufacturing system rather than adopting one tool fir
Publishing over time
Last 90 days. Choose a month to open its work.
Recurring subjects
Named in the text we hold. One piece can cover several.
Audience
No verified audience measurement yet.
About this data
Counts cover the work we have indexed. Tone needs enough text and a confident classification. Excerpts and episode notes are not full articles or transcripts.
Identity or attribution wrong? Suggest a correction.