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Damnang’s Substack

Welcome to my Substack. Here, I share in depth analysis of semiconductor technology, companies, and industry trends in a way that is still easy for non specialists to follow. I hope you gain many valuable insights along the way.

Newsletter · By Damnang · English · Official site

Indexed issues, last 90 days
12
Latest publication
Oct 1, 2026
Audience
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Earliest in this view
Aug 28, 2026

Latest issues

  1. Issue · Oct 1, 2026

    New here? Start with the article map (opens the original)

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    I built a site for my Substack subscribers.Go Damnang<img alt="" class="sizing-normal" height="788" src="https://substackcdn.com/image

  2. Issue · Sep 30, 2026

    [Expert Call Report] How Is Micron Making HBM Faster? (opens the original)

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    <img alt="Conceptual semiconductor package showing a GPU and stacked HBM on an interposer" class="sizing-normal" height="728" src="https://substackcdn.com/image/fetch/$s_!0SzA!,w_1456,c_limit,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazo

  3. Issue · Sep 24, 2026

    Ciena & Fabrinet: The Road Ahead for Optics (opens the original)

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    In this piece, we examine where optics and photonics are heading, combining our industry work with conversations with management at Fabrinet (NYSE: FN) and Ciena (NYSE: CIEN). Both companies are crucial players in the optical ecosystem, but they operate at very different points in the value chain.This piece does not outline an actionable “high-conviction” idea, but instead explores what is happening in the optics sector and the key trends to watch.I partnered with with Aurelion Research on this

  4. Issue · Sep 23, 2026

    [Expert Call Report] Samsung HBM Hybrid Bonding: From Technology to Volume Production (opens the original)

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    The expert who participated in this call is a Samsung packaging engineer specializing in HBM hybrid bonding research and development. With experience spanning equipment, process development, and R&D, he brings a broad perspective across the packaging stack and shared a number of practical insights throughout this discussion.The Starting QuestionIf HBM stacks move to eight or even four layers, will that delay the adoption of hybrid bonding? This was one of the questions I wanted to explore in thi

  5. Issue · Sep 17, 2026

    [Expert Call Report] Intel's Competitive Position (opens the original)

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    This article is based on an expert call lasting one to two hours. I plan to publish more institutional style expert call reports like this regularly on my Substack. I hope you will continue to follow and support my work.Note: After organizing the content, I asked AI to help summarize and edit it. Please note that some signs of AI assistance may be present in the writing.Subscribe nowInterview OverviewThis conversation examined the benefits Intel’s p

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