HeyJaredChipPub
Share at least one chip/semiconductor industry analysis or technical practice every day.
- Indexed issues, last 90 days
- 27
- Latest publication
- Sep 30, 2026
- Audience
- Checking…
- Earliest in this view
- Aug 31, 2026
Latest issues
ASML Computational Lithography Explores DUV Potential (opens the original)
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<img alt="" class="sizing-normal" height="819" src="https://substackcdn.com/image/fetch/$s_!eXYg!,w_1456,c_limit,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazonaws.com%2Fpublic%2Fimages%2Fa877389a-44c9-4472-8e83-2f87d2dcdbe4_1792x1008.j
New Compute War in Auto Factory Vision Inspection (opens the original)
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<img alt="" class="sizing-normal" height="819" src="https://substackcdn.com/image/fetch/$s_!hnHu!,w_1456,c_limit,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazonaws.com%2Fpublic%2Fimages%2Fbb657db9-75aa-40de-be63-9986f6ad19b6_1792x1008.j
Why Is Everyone Eyeing 3D DRAM? (opens the original)
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<img alt="" class="sizing-normal" height="819" src="https://substackcdn.com/image/fetch/$s_!oEFm!,w_1456,c_limit,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazonaws.com%2Fpublic%2Fimages%2Fe2666f8a-d9ca-43f0-9f4a-5d1132d68a4f_1792x1008.j
Memory Chips, A New Upheaval! (opens the original)
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<img alt="" class="sizing-normal" height="819" src="https://substackcdn.com/image/fetch/$s_!xZ4B!,w_1456,c_limit,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazonaws.com%2Fpublic%2Fimages%2F74d29b24-b63d-47f5-ba11-e2401d117531_1792x1008.j
Qualcomm Rebuilds Snapdragon for the Agentic AI Era (opens the original)
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After years of accumulation, agentic AI has reached a tipping point. Especially with the recent surge of Agents and on-device inference, AI now seems only one step away from reaching every industry.But to empower every endpoint with AI, it is not enough to build massive cloud compute for larger models. Vendors also need to create matching compute foundations for different devices. For battery-powered products in particular, the challenge is to deliver chips that balance performance, power, and c
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