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- Indexed articles, last 90 days
- 22
- Latest publication
- Sep 18, 2026
- Outlet visibility, for Electronics Weekly
- Top 5M sites
- Earliest in this view
- Jul 20, 2026
Latest articles
Dealing in AI - who holds the cards? ⋆ Electronics Weekly (opens the original)
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The Trump administration takes an uncertain hand into critical technology negotiations with China next week, writes Paul Dempsey. Mounting controversy over AI safety and regulation spilled over into great power rivalry this week as figures including Anthropic CEO Dario Amodei and former Trump aide, Steve Bannon, turned their fire on China. Their comments have raised tensions before next week’s summit and state visit in Washington DC led by Chinese President Xi Jinping, compounding a tough pre-ta
CIOE reflects industry shift to HPC and AI ⋆ Electronics Weekly (opens the original)
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The 27th China International Optoelectronic Exposition (CIOE 2026) took place this week (09-11 September) at the Shenzhen World Exhibition & Convention Center, China. CIOE’s 4,000 exhibitors represent multiple markets, although this year is defined by the event’s focus on AI-driven optical interconnect this year. Within CIOE is the Information and Communication Expo which showcases how traditional copper interconnects are being superseded by optical interconnects. Many exhibitors, including Semt
LattePanda creates for micro module for on-device AI ⋆ Electronics Weekly (opens the original)
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A micro x86 compute module has been purpose-built by LattePanda for projects running on-device AI, such as robotics, portable instruments, vision AI and industrial automation. The LattePanda Mu Ultra is a 69.6mm x 60mm module, powered by Intel Core Ultra 5 226V and Ultra 7 256V processors. It delivers up to 115 TOPS of AI performance, inlcuding 47 TOPS from the dedicated NPU. It also has 6GB of LPDDR5X-8533 memory, and up to 11.6GB available for graphics memory. The memory architecture supports
Everspin Technologies partners with Teledyne HiRel for MRAM in mil-aero ⋆ Electronics Weekly (opens the original)
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A strategic partnership between MRAM manufacturer, Everspin Technologies and Teledyne HiRel Semiconductors will mean that the 256Mb Persyst spin-transfer torque MRAM (STT-MRAM) will be used in Teledyne HiRel’s memory products for mil-aero customers. The MRAM combines RAM-like speed and the ability to retain data through power loss, system resets and interruptions. These capabilities are especially important for startup, configuration storage, event logging, recovery and other functions that must
Curing and annealing oven is sized for single panel format ⋆ Electronics Weekly (opens the original)
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Weisun has added a single panel size curing and annealing oven for fan-out panel level packaging (FOPLP) lines. The 310mm x 310mm chamber has been added to the company’s AQWOL-5S range for osat (outsourced semiconductor assembly and test) and substrate makers. The chamber is more than half the size of a standard chamber; Weisun has scaled warpage and alignment error and introduced cure and anneal. “Oven performance therefore bears directly on panel level packaging yield,” says the company. The 3
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